1. 2. 3. material content data sheet sales product name bss159n h6327 issued 29. august 2013 ma# MA000919342 package pg-sot23-3-5 weight* 9.32 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.008 0.09 860 non noble metal tin 7440-31-5 0.002 0.02 222 inorganic material silicon 7440-21-3 0.091 0.97 1.08 9745 10827 leadframe non noble metal chromium 7440-47-3 0.009 0.10 969 inorganic material silicon 7440-21-3 0.001 0.01 65 non noble metal titanium 7440-32-6 0.003 0.03 323 non noble metal copper 7440-50-8 3.000 32.18 32.32 321774 323131 wire non noble metal copper 7440-50-8 0.008 0.08 0.08 832 832 encapsulation organic material carbon black 1333-86-4 0.058 0.62 6187 plastics epoxy resin - 1.240 13.30 133012 inorganic material silicondioxide 60676-86-0 4.471 47.95 61.87 479461 618660 leadfinish non noble metal tin 7440-31-5 0.150 1.60 1.60 16048 16048 plating noble metal silver 7440-22-4 0.284 3.05 3.05 30502 30502 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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